• Technical support

    Layer
    count
    4L 2L 6L 6L 8L 10L 12L 14L 16L
    Layer
    Structure
    product
    type
    Depth
    control drill
    Copper base
    PCB
    Buried copper
    inlaid
    1 + N HDI,
    Buries holes
    Mechanical back drilling
    Etching back drill
    2 + N HDI, POFV Heavy,
    copper
    Countersink
    head holes
    High layer
    count
    Item Manufacture Capability Manufacture Capability
    Layer 2-30 Layer 2-30 Layer
    Thickness 0.3-3.5 mm 0.2-5.0 mm
    Laminate Type FR-4、High TG PTFE、PTFE
    Copper Foil Thickness 1/3-6 oz 1/3-14 oz
    Min.Line Width/Space 75 um/75 um 50 um/60 um
    Min. Through hole diameter 0.15 mm 0.15 mm
    Micro channel thickness ratio 12:1 15:1
    Min. Blind hole diameter 4 mil 4 mil
    Blind aperture ratio 0.7:1 1:1
    Min. Dielectric thickness 50 um 25 um
    Wiring layer 2+N+2 3+N+3
    Surface Finish HASL,ENIG,Immersion Tin,Immersion Silver,OSP